Packaging Technologies 2 Session
Session Type: Poster
Session Code: PK-P
Location: Poster 2
Date & Time: Wednesday June 04, 2025 (16:10 - 18:00)
Chair: Haruka Shimizu,
Yuichi Onozawa

 

   

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My Sched		Paper
Id		TopicTitle/Author
5062 6 Thermal Management by Using Small-Area Chips and AI-Based Design Optimization in SiC Modules
Teruyuki Ohashi, Shun Takeda, Eitaro Miyake, Hiroshi Kono, Tomohiro Iguchi, Kazuya Kodani, He Du, Yasunori Taguchi, M...
5064 6 A Novel High-Performance Double-Sided Cooling SiC Power Module Based on Cu Sintering
Haobin Chen, Haidong Yan, Kuang Sheng
5097 6 Source Current Circulation Phenomenon and Suppression Method of High Voltage SiC Devices
Xinling Tang, Yaohua Wang, Xiaoguang Wei, Jingfei Wang, Jingzhi Chen, Yujie Du, Liang Wang, Hao Zhang
5132 6 Non-Intrusive Online Junction Temperature Monitoring in Si and SiC Power MOSFETs
Miquel Tutusaus, Xavier Perpiñà, Miquel Vellvehi, Manuel Fernández, Sergio Llorente, Xavier Jordà
5155 6 Chip-Level Interconnection Techniques for Chip Embedding Integration of SiC MOSFETs
Emma Solà, Mariana Raya, Philippe Lasserre, David Sánchez, José Rebollo, Miquel Vellvehi, Xavier Perpiñà, Xavier Jord...
5173 6 A Novel Lifetime Prediction Method for Press Pack Devices Based on Fretting Wear
Xiaoguang Wei, Xinling Tang, Jianhui Liu, Jingfei Wang, Kefan Yu, Yujie Du
5189 6 A GaN Power Module Using a Copper PCB with Integrated Liquid-Cooled Heat Exchanger
Jingyuan Liang, Xuan Wang, Xiaoyun Zhang, Chun Yin Au Yeung, Andrei Catuneanu, Matthew Birkett, Wai Tung Ng