Packaging Technologies Session
Session Type: Lecture
Session Code: PK
Location: Lecture Room
Date & Time: Wednesday June 04, 2025 (14:00 - 15:40)
Chair: Xavier Jorda,
Wei-Chung Lo

 

    Papers are listed in the order they will be presented.

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My Sched		Paper
Id		TopicTitle/Author
5190 6 Low Loop Inductance in Power Semiconductor Module with Direct-Lead Bonding Busbar
Jiyoon Choi, Sihoon Choi, Jun Imaoka, Masayoshi Yamamoto
5195 6 Packaging Technology and Evaluation Result of Ultra- Compact Double-Side Cooled Power Module
Yoshihiro Tateishi, Akira Kitamura, Keita Suzuki, Satoharu Tanai, Tetsuo Endoh, Yoshikazu Takahashi
5269 6 SiC MOSFET Chip Embedded Switching-Cell for Multilevel Converters
Mariana Raya, Emma Solà, Miquel Vellvehi, Xavier Perpiñà, Philippe Lasserre, Sergio Busquets-Monge, Xavier Jordà
5255 6 Impact of Cu Clip and Wire-Bonded Packaging on the Surge Current Capability of SiC MOSFETs in the Third Quadrant
Feilin Zheng, Binqi Liang, Chao Zheng, Xuebao Li, Zhibin Zhao, Xiang Cui
5312 6 Stability Analysis Based on a Virtual Twin of SiC Power MOSFET Module
Ivana Kovacevic-Badstübner, Anja Brandl, Michel Nagel, Fernando Aguilar Vega, Bogdan Popescu, Dan Popescu, Ulrike Gro...