A Quantitative Sputtering Method for Accurate Composition Calibration of 2.5 μm Thin Au-Sn Metallization Enabling WLP Slid Bonding
Student Contest:
No
Affiliation Type:
Academia
Keywords:
Wafer-level Packaging, Sputtering, Au-Sn bonding
Abstract:
This paper presents a quantitative approach for Au-Sn metallization with accurate mass calibration, which is applicable to solid-liquid interdiffusion (SLID) bonding of MEMS wafer-level packaging (WLP) devices, particularly those that demand a thin-layer solder within the WLP structure.
