Advanced 3D technology for logic and memory devices  Chair: Mikael Ostling - KTH; Guilhem Larrieu - LAAS CNRS;

DTCO and STCO  Chair: Sung-Min Hong - Gwangju Institute of Science and Technology; Tom Herrmann - GlobalFoundries;

Time-interleaved high-speed ADCs  Chair: Claudio Nani - Marvell; Liang Qi - Shanghai Jiao Tung University;

Low Phase Noise Oscillators   Chair: Akshay Visweswaran - Nokia Bell Labs; Kevin Jun Yin - University of Macao;

Energy Delivery Circuits: Wireless Links & Chargers  Chair: Tom Van Breussegem - ICsense; Gael Pillonnet - CEA;

Efficient Die to Die Wireline Interface Design  Chair: Harijot Singh Bindra - University of Twente;

Digital Compute-in-Memory  Chair: Riccardo Zurla - STMicroelectronics; Takashi Maeda - Kioxia;

Image sensors  Chair: Daniele Perenzoni - Sony; Cédric  Tubert - STMicroelectronics;

Characterization and Development of Analog, RF and Power Components  Chair: Christoforos Theodorou - Grenoble INP; Michael Waltl - TU Wien;

Amplifiers and Filters  Chair: Marco Berkhout - Monolithic Power ; Komail Badami - CSEM;

Circuits beyond E-band  Chair: Tyler Ross - Teradar; Minoru Fujishima - Hiroshima University ;

Digital Circuits and Security  Chair: Marisa Lopez-Vallejo - Universidad Politécnica de Madrid; Milena Ivanov - Micron;

HF-to-Y Band Wireless Systems  Chair: Antonio Liscidini - University of Toronto; Davide Ponton - Infineon Technologies;

Charge-based Compute-In-Memory  Chair: Louis Hutin - CEA Leti; Giovanni salvatore - University of Venice;

Analog and Emerging Non-Volatile Memory CIM  Chair: Manuel Le Gallo-Bourdeau - IBM; Hongyang Jia - Tsinghua University;

Devices for optoelectronics sensing  Chair: Sara Pellegrini - STmicroelectronics; Antoine Dupret - CEA;

Memory Modeling and Simulation  Chair: Elena Gnani - University of Bologna; Eberhard Bär - Fraunhofer IISB;

Nyquist ADCs from SAR to pipeline  Chair: Burak Gönen - StarIC; Jorge Lagos Benites - imec;

RF and mm-Wave Frequency Synthesis   Chair: Fabio Padovan - Infineon Technologies AG; Nereo Markulic - IMEC;

Hardware Accelerators  Chair: Makoto Ikeda - University of Tokyo; Kathryn Wilcox - AMD;

Fast-Transient Regulation for Displays, IVRs and 3D Power  Chair: Tim Piessens - KULeuven; Edoardo Bonizzoni - University of Pavia;

ReRAM-based Compute-In-Memory  Chair: Daniele Lelmini - Politecnico di Milano; Wooseok Choi - IBM;

MEMS, inertial and stress sensors  Chair: Clara  Moldovan - Sensirion; Ralf Brederlow - Technical University of Munich;

Sub-THz Wireless Chips  Chair: Vojkan Vidojkovic - TU Eindhoven; Jeffrey Walling - Virginia Tech University;

Reliability and new device concepts  Chair: Andrea Redaelli - ST Microelectronics; Claire Fenouillet-Beranger - CEA;

References and Oscillators  Chair: Zili Yu - IMS Chips ; Taekwang Jang - ETH Zurich ;

RF techniques for communications systems  Chair: Mark Oude Alink - University of Twente; Hua Wang - ETH Zurich;

Fractional PLLs and key Building Blocks  Chair: Luca Bertulessi - Politecnico di Milano; Staffan EK - Ericsson;

High Performance Electrical and Optical Front End Design for Wireline  Chair: Declan Carey - AMD; Bart Moeneclaey - Ghent University—imec;

Brain-Inspired and Alternative AI Paradigms  Chair: Melika Payvand - University of Zurich; Joachim Rodrigues - FAU Erlangen-Nürnberg;

IC systems for biosensing  Chair: Jan Genoe - IMEC; Georgi Radulov - TU Eindhoven;

Compact Modeling of Emerging Devices  Chair: Jens Trommer - NaMLab gGmbH; Ashkhen Yesayan - École Polytechnique Fédérale de Lausanne;

Sensors and Readout ICs  Chair: Piero Malcovati - University of Pavia; Takuji Miki - Kobe University;

Progress in Delta-Sigma ADCs  Chair: Muhammed Bolatkale - NXP; Francesco Conzatti - Infineon;

System on Chip  Chair: Martin Cochet - IBM; Davide Bottamedi - Infineon;

Power Drivers, Protection and Mixed-Signal Power Blocks  Chair: Nick Van Houtven - Mindcet; Makoto Takamiya - Tokyo University;

Cryo-CMOS Circuits and Systems  Chair: Edoardo Charbon - EPFL; Robert Bogdan Staszewski - University College Dublin;

Devices for neuromorphic applications  Chair: Qing-Tai Zhao - Jülich University; Aarthi Jayakumar - NXP;

Reliability and Transport Modeling  Chair: Mike Schwarz - Technische Hochschule Mittelhessen; François Triozon - CEA Leti;

Hybrid and Switched-Capacitor Converters for Dense Power  Chair: Francesco Rezzi - Inventvm; Nicolo Zilio - Infineon;

Wireline Circuit and Signalling Techniques  Chair: Armin Tajalli - University of Utah;

LLMs, Transformers, and Generative AI Accelerators  Chair: Jae-Sun Seo - Cornell Tech; Guilherme Paim - University of Lisbon;

Neural Interface and implantable bioelectronics  Chair: Piotr Kmon - AGH University of Krakow; Frank Badets - CEA;

High performance front-end solutions for wireless systems  Chair: Yang Zhang - imec; Philippe Cathelin - STMicroelectronics;

Cryogenic devices, and low-noise amplifiers  Chair: Walter Weber - University of Vienna; Vadim Issakov - Technische Universität Braunschweig;

Heterogeneous AI Systems and SoC Integration  Chair: Kavya Sreedhar - Google; Francesco Conti - University of Bologna;