High Performance RF Building Blocks  Chair: Miao Meng - Tongji University; Fanyi Meng - Tianjin University, China;

Advanced Memory for Compute, Search, and Intelligence  Chair: Longyang Lin - Southern University of Science and Technology; Hui Zhang - National University of Singapore;

SS.20: Innovative Circuits and Systems: From Sensing to Intelligent Computing  Chair: Jerald Yoo - Seoul National University;

Data Converter Techniques  Chair: Moonhyung Jang - NUS; Mingqiang Guo - University of Macau;

DC-DC Converters  Chair: Yingyi Yan - University of Electronic Science and Technology of China; Junmin Jiang - Southern University of Science and Technology;

SS15.11: Advanced Millimeter-Wave to Sub-THz Architecture, Circuits and Systems for Next-Generation Communication  Chair: Kenichi Okada - Institute of Science Tokyo, Japan; Chun Wang - Zhejiang University;

SS15.21:Sensors, Sensing Circuits and Systems  Chair: Jiang Wei - Hong Kong University of Science and Technology;

Chips and Systems for Intelligent Robot and Embodied AI  Chair: Haozhe Zhu - Fudan University; Mingyu Wang - Sun Yat-sen University;

SS15.6: Research Trends of RF Power Devices  Chair: Wen-Cheng Lai - Ming Chi University of Technology, Taiwan;

SS15.15: AI-Era Optical Interconnects: Electronic-Photonic Co-Design and integration  Chair: Dan Li - Xi'an Jiaotong University, China;

SS15.13: Power IC Technology for AI Data Centers  Chair: Wai Tung Ng - University of Toronto; Weijia Zhang - Hong Kong University of Science and Technology;

SS15.2: Spintronics Computing and Logic  Chair: Yan Zhou - The Chinese University of Hong Kong;

Design Automation and Optimization  Chair: TBA

Packaging, Reliability, and Emerging Devices   Chair: Tao HANG - Shanghai Jiao Tong University; Faxing CHE - Micron Semiconductor, Singapore;

SS15.5:RF, Millimeter-Wave and Terahertz Integrated Circuits for Wireless Communication and Sensing  Chair: Keping Wang - Tianjin University;

SS15.1: Breakthrough in Ultra-Broadband 5G/6G Communication Chips  Chair: Fanyi Meng - Tianjin University, China;

AI Accelerators for DNN and Transformers  Chair: Aili Wang - Zhejiang University–UIUC Institute; Bo Wang - Singapore Univ. of Technology and Design;

SS15.3: Communication, packaging and hybrid Integration in AI area：Theories, Algorithms, and Applications  Chair: Yujie Li - Beijing Information Science and Technology University, China;

SPAD Imaging and Advanced Sensor Interfaces   Chair: Hua Fan - University of Electronic Science and Technology of China; Runjiang Dou - Institute of Semiconductors, Chinese Academy of Sciences;

EH, WPT, and Gate Driver  Chair: Weijia Zhang - Hong Kong University of Science and Technology; Dongfang Pan - University of Science and Technology of China;

RF Front-End and Frequency Generation  Chair: Yuncheng Zhang - Institute of Science Tokyo; Shiheng Yang - University of Electronic Science and Technology of China;

SS15.17: Next-Generation Wireless Technologies for Biomedical and IoT Applications  Chair: Hwun-su Lee - Nanyang Technological University;

SS15.9: Compute-in-memory architectures, circuits and devices for next-generation AI systems  Chair: Yuqi Su - Peking University;

SS15.16: Domain-specific Hardware Design for Perception of UAVs, Humanoid Robots and Autonomous Vehicles  Chair: Ye Liu - University of Electronic Science and Technology of China;

In-memory Computing Devices  Chair: Lin Bao - Beijing University of Posts and Telecommunications; Zongwei Wang - Peking University;

Modeling, Simulation & Thermal Analysis  Chair: TBA

SS15.9: Evolving RF, mm-Wave, and THz Front-Ends for Next-Generation Sensing and Communication Systems  Chair: Xiang Yi - South China University of Technology;

Efficient Accelerators for AI and Cryptography  Chair: Ye Liu - University of Electronic Science and Technology of China; Chao Wang - Huazhong University of Science and Technology;

Domain Specific and AI Assisted ICs  Chair: Lujie Peng - Shenzhen University of Advanced Technology; Tao Tang - Guangdong Institute of Intelligence Science and Technology;

High-Speed Wireline and Optical Circuits  Chair: Xin Wang - University of Ghent/IMEC, Belgium; Fuzhan Chen - AMF, Singapore;

SS15.12: Advanced CMOS RF and mmWave Frond-end Circuits  Chair: Fanyi Meng - Tianjin University, China;

SS15.4: IC based modules, system integration and applications  Chair: Hu Fang - College of Information Engineering, Hubei University of Chinese Medicine;

SS15.8: Energy-Efficient Circuits and Systems for Intelligent Sensing and Wireless Data/Energy transfer  Chair: Atila Alvandpour - Linköping University, Sweden;

Emerging Semiconductor Devices  Chair: Sunbin Deng - Huazhong University of Science and Technology;

Analog Circuit Techniques  Chair: Yuan Gao - ASTAR; Yuxuan Luo - Zhejiang University;

SS15.14: Millimeter-Wave and Terahertz Signal Generation for Next-Generation Communications and Sensing  Chair: Cheng Yong - Tsinghua University;

SS15.18: Advanced Power Delivery for AI Computing: System Architectures, Modeling, and Converter Innovations  Chair: Zhiguo Tong - Beihang University;

SS15.10: Advances in RFIC Design: Integrated Passive and Active Components for Next-Generation Systems  Chair: Forest Zhu - University of Technology Sydney;

RF Circuits  Chair: TBA

Processor and Chiplet Architectures  Chair: Fengbin Tu - Hong Kong University of Science and Technology; Xin Si - Southeast University;

High-Speed Wireline and Optical Circuits (poster)  Chair: Fuzhan Chen - AMF, Singapore; Xin Wang - University of Ghent/IMEC, Belgium;

EDA, Modeling and Design Optimization  Chair: TBA

Chips and Systems for Intelligent Robot  Chair: Zhuo Zou - Fudan University; Mingyu Wang - Sun Yat-sen University;

AI for ICs  Chair: TBA

Analog Techniques  Chair: Yuan Gao - ASTAR;

Poster Session of Power Management ICs  Chair: Yang Jiang - University of Macau;

Biomedical ICs and Systems  Chair: Sunwoo Lee - Nanyang Technological University;

Thermal and Optical CMOS Sensing Systems  Chair: Ka-Meng Lei - University of Macau;

Emerging Memory Devices and Architectures  Chair: Can Li - The University of Hong Kong;

Materials for packaging and Integration  Chair: Jun WANG - Fudan University;

Emerging device  Chair: Chenxi Zhu - University of Science and Technology of China;